Wire & Cable
8 Jun 2021
Belden Continues to Transform LANs and Industrial Sites with Innovative Solutions
Belden Inc. (NYSE: BDC), a leading global supplier of specialty networking solutions, continues to offer its customers more options to manage high density, reduce installation time and safely transmit data and power with new Q2 2021 product launches.
3 Mar 2021
Belden’s HiOS Software Upgrade Designed to Meet the Needs of Industry 4.0
Belden Inc. (NYSE: BDC), a leading global supplier of specialty networking solutions, has released the latest version of its Hirschmann Operating System (HiOS). Complete with an embedded Open Platform Communications Unified Architecture (OPC UA) server, the software provides a seamless, brand-agnostic solution as industrial automation moves towards Industry 4.0. Belden is the only manufacturer to offer switches that can natively run this communication protocol.
27 Jan 2021
Belden Announces Acquisition of OTN Systems N.V.
Belden Inc. (NYSE: BDC), a leading global supplier of specialty networking solutions, today announced that it has entered into a definitive agreement to acquire privately held OTN Systems N.V., a leading provider of automation networking infrastructure solutions, for approximately $71 million, net of cash acquired. The transaction is expected to close in the first quarter 2021, subject to customary closing conditions, and will be financed with cash on hand, which was approximately $500 million at the end of 2020. Separately, the Company increased its revenue and EPS guidance for the fourth quarter 2020.
19 Jan 2021
Belden Future-Proofs Large Industrial Networks with Advanced Security and Redundancy
Belden Inc. (NYSE: BDC), a leading global supplier of specialty networking solutions, has released its Hirschmann BOBCAT High-Port Switch, the newest addition to the growing BOBCAT family. This managed switch, with up to 24 ports, offers a compact yet powerful networking solution for the Industrial Internet of Things (IIoT).
16 Nov 2020
Mondi scoops six awards for its expertise in Turkish packaging competition
Mondi, a global leader in packaging and paper, has scooped six competency awards in the prestigious Turkish Crescents and Stars for Packaging 2020 Competition, organised by the Turkish Packaging Manufacturer’s Association.
11 Aug 2020
TE Connectivity’s AMPMODU 2 mm wire-to-board crimp receptacles and shrouded headers free up space on printed circuit boards
TE Connectivity (TE), a world leader in connectivity and sensors, is freeing up valuable space on printed circuit boards (PCBs) for design engineers with its new compact AMPMODU wire-to-board receptacles with crimp contacts and shrouded headers. With centerline distances of 2 mm, they occupy 38 percent less space on a PCB than connectors with a 2.54 mm [0.100”] centerline.
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